高性能计算
高性能计算
产品型号：GPU
产品描述：
◆ Structure:12L,5+2+5
◆ Core: BT / thickness 0.8mm
◆ Bulid up : GX92/ thickness 25μm
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◆ Structure : 2L,Total thickness170 μm, core thickness 100μm;◆ MSAP process，L/S=20/20μm◆ 75μm laser dirlled “X” hole ，copper filled.Bonding finger Pitch: 95μm(50/40μm)BOL Pitch: 55μm(25/30μm)◆ Surface finish:Soft Ni/Au+OSP +Etch-back
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GPU高性能计算
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◆ Structure:12L,5+2+5◆ Core: BT / thickness 0.8mm◆ Bulid up : GX92/ thickness 25μm
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FCBGA倒装芯片球栅格阵列
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◆ Structure : 6L, 2+2+2,Total thickness 400 μm, core thickness 150μm;Inner layer: 75μm laser dirlled“X” hole ,copper filled. Outer layer:60μmlaser blind via.◆ Fine line: inner layerMSAP process,L/S=15/15 μm.◆ AUS SR1/thickness 15+/-7μm，SRO=105μm，SM shift tolerance≤15...
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